METHOD FOR FORMING METAL WIRING, METHOD FOR MANUFACTURING ACTIVE MATRIX SUBSTRATE, DEVICE, ELECTRO-OPTICAL DEVICE, AND ELECTRONIC APPRATUS

摘要

A device includes a substrate; a bank provided on the substrate; and a metal wiring in a wiring forming region of the substrate that is sectioned by the bank with a liquid phase method. The metal wiring includes a first film formed along a bottom of the wiring forming region and a side face of the bank facing the wiring forming region. The metal wiring also includes a second film disposed on the first film.