发明名称 |
SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC APPLIANCE HAVING THE SEMICONDUCTOR DEVICE |
摘要 |
In order to connect a semiconductor device including an integrated circuit to an external circuit typified by an antenna, the shape of the contact electrode to be formed in the semiconductor device is devised, so that bad connection between the external circuit and the contact electrode is not easily caused and the contact electrode with high reliability is provided. The contact electrode is formed by a screen printing method using a squeegee having a chamfered corner or having a wedge shape. The contact electrode has a peripheral portion and a central portion. The peripheral portion has a tapered portion with its film thickness gradually decreasing from the central portion toward the end portion, and the central portion has a projection portion that continues from the tapered portion. |
申请公布号 |
WO2007125841(A1) |
申请公布日期 |
2007.11.08 |
申请号 |
WO2007JP58691 |
申请日期 |
2007.04.17 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD.;YAMADA, DAIKI;AOKI, TOMOYUKI |
发明人 |
YAMADA, DAIKI;AOKI, TOMOYUKI |
分类号 |
H01L23/12;G06K19/07;G06K19/077;H01L21/288;H01L21/3205;H01L21/60;H01L23/52;H01L29/786 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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