CONNECTION STRUCTURE AND METHOD OF PRODUCING THE SAME

摘要

A connection structure and a method of producing the same. The connection structure (package (10)) has a first plate-like body (101) where a wiring pattern having connection terminals (102) is formed and also has a second plate-like body having at least two or more connection terminals (electrode terminals (104)) arranged facing the connection terminals. The connection terminals of the first and second plate-like bodies are connection terminals formed as projections on the surfaces of the first and second plate-like bodies, respectively. An electrically conductive substance (108) is accumulated to cover at least portions of the side faces of the connection terminals of the opposite first and second plate-like bodies, and the opposite connection terminals are electrically connected to each other by the electrically conductive substance. The package contributes to increased productivity, has excellent reliability, and can cope with use of more pins and narrower pin pitch in semiconductor chips of the next generation. The connection structure is applicable to the production of the package. A method of producing the connection structure is also provided.