A fabrication tool (100) presses a first device surface (103) against a second device surface (105) after the first and the second device surfaces have been plasma activated, to bond the first device surface with the second device surface. The fabrication tool includes a bonding piston (102) to exert force on the first device surface to press the first device surface against the second device surface. The fabrication tool also includes a pressure plate (104) situated between the bonding piston and the first device surface. The fabrication tool further includes a mechanism (106, 110) to ensure that the force exerted by the bonding piston on the first device surface via the pressure plate is initially exerted at one or more first locations on the first device surface and subsequently exerted at one or more second locations on the first device surface.
申请公布号
WO2007127825(A2)
申请公布日期
2007.11.08
申请号
WO2007US67472
申请日期
2007.04.26
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;CHEN, CHIEN-HUA;SCHWINABART, TROY D.;ATKINSON, WILLIAM M.
发明人
CHEN, CHIEN-HUA;SCHWINABART, TROY D.;ATKINSON, WILLIAM M.