FOAM SOLDER AND ELECTRONIC COMPONENT

摘要

Electronic components having a semiconductor element bonded to a substrate with solder weaken in bonding strength when a clearance between the semiconductor element and the substrate is not suitable. Therefore, foam solder having high melting point metallic particles dispersed in solder has been used to manufacture electronic components. However, when the electronic components are manufactured with the conventional foam solder, there have been cases where the semiconductor element is tilted and the bonding strength is not sufficient. A foam solder of this invention has a fluctuation of size of the high melting point metallic particles of 20µm or less when the metallic particle diameter is 50µm. An alloy layer composed of the high melting point metallic particles and the main component of solder is formed on the circumference of the high meting point metal particle. Furthermore, there is no void at all in the solder. In the electronic component, a semiconductor element is bonded to a substrate with the foam solder, and the electronic component has excellent heat cycle characteristics.