CLAD MATERIAL FOR WIRING CONNECTION AND WIRING CONNECTION MEMBER PROCESSED FROM THE CLAD MATERIAL

摘要

[PROBLEMS] To provide a wiring member and its material that do not allow molten solder to attach to the press heating portion of a local heating apparatus and are excellent in workability in soldering. [MEANS FOR SOLVING PROBLEMS] A clad member (1) for wiring connection comprises a conductive layer (2) formed of pure Cu or Cu-alloy having a more excellent conductivity than pure Al, a surface layer (3) formed of pure Al or Al-alloy and stacked on one surface of the conductive layer (2), and a solder layer (4) formed by plating molten solder on the other surface of the conductive layer (2). A wiring connection member is processed from the clad material (1) for wiring connection and has a first connection end having the conductive layer and soldered to the electrode of a semiconductor device and a second connection end having the conductive layer and soldered to, for example, an external wiring.