Component e.g. semiconductor component, transporting and handling device, has semiconductor components accommodated and transported to workpiece carriers, where adjustment of size of carriers takes place in position for all recesses

摘要

The device has semiconductor components (15) accommodated and transported to mechanically adjustable workpiece carriers in a form-fit manner, where complete finishing of the components is possible by stages such as testing, examining and marking, on upper and lower surface of the device on basis of a wheel arrangement. A transport wheel (3) and an axially and radially relocatable counterpart (14) are fixed in a reciprocative manner, where an adjustment of the size of the workpiece carriers takes place in a position for all recesses.