SEMICONDUCTOR LIGHT EMITTING ELEMENT AND WAFER

摘要

Provided are a semiconductor light emitting element wherein light extracting efficiency is improved without increasing the number of manufacturing steps, and a wafer. A semiconductor light emitting element (1) is formed by laminating a compound semiconductor layer (3) on a single crystal substrate and dividing the single crystal substrate into pieces. A side plane (21), which is a reference plane of the divided substrate (2), i.e., a divided single crystal substrate, forms an angle of 15° to the (1-100) plane, so that the side planes (21-24) of the divided substrate (2) are different planes from the cleaved planes of a crystal structure of the single crystal substrate.