| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacturing method of a microphone, for forming a cavity in a semiconductor substrate by etching from a front surface side and easily forming vent holes with large acoustic resistance. SOLUTION: A sacrifice layer 36 is exposed from a chemical injection port 31 to remove the sacrifice layer 36 and another sacrifice layer 35 through etching by etchant introduced from the chemical injection port 31. The surface of an Si substrate 22 is exposed in an etching window 34 where the sacrifice layer 35 is removed, so that the cavity 23 is produced below the etching window 34 by the crystal anisotropic etching of the Si substrate 22. On the other hand, the surface of Si substrate 22 is covered by a protecting film 32 in a space from where the sacrifice layer 36 is removed by etching, so that the Si substrate 22 is not be etched and the vent hole 26 is formed there. COPYRIGHT: (C)2008,JPO&INPIT |
