| 摘要 |
PROBLEM TO BE SOLVED: To prevent damage of a signal line when bending a flexible substrate, also shorten the signal line on the flexible substrate, and to improve the high-frequency characteristics. SOLUTION: A substrate and an OSA (optical subassembly) are connected via the flexible substrate 100 capable of impedance matching. The flexible substrate 100 has a through-hole 110 on a packaging land 111, to be connected to the substrate and routes the signal line to the rear of the land 111 via the through-hole 110. The signal line is formed of a rear copper foil 105 on the rear side, and a rear cover lay 109 is applied thereon. When the flexible substrate 100 is bent, it is bent at a border Q of the packaging land 111. Since the rear cover lay 109 is applied to the border Q, the signal line will not break; and in addition, the OSA becomes closer to the substrate and the signal line will be shortened. The high-frequency characteristics can be thus made proper. COPYRIGHT: (C)2008,JPO&INPIT
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