| 摘要 |
PROBLEM TO BE SOLVED: To clean a substrate uniformly with high quality while eliminating uneven cleaning in the plane of the substrate without requiring cost and labor more than now required. SOLUTION: Single wafer cleaning equipment for cleaning a substrate by means of a brush comprises a holder for holding a wafer, a brush for cleaning the substrate held by the holder, a servo drive arm for controlling at least the turning position and the height position of the brush fixed thereto, and a pressing force sensor arranged independently of the servo drive arm and the brush in order to measure the pressing force of the brush. The servo drive arm can arrange the brush automatically at a cleaning height position where the substrate held by means of the holder is pressed with a predetermined pressing force, with reference to the height position of the brush pressed against the pressing force sensor with a predetermined pressing force. COPYRIGHT: (C)2008,JPO&INPIT
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