| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film which can prevent damages, etc. on a semiconductor component when manufacturing a semiconductor package, etc., and to provide a semiconductor device using the same. SOLUTION: The adhesive tape is used to join the semiconductor component and a substrate, and consists of a resin composition containing thermosetting resin. The adhesive film has an elastic modulus of 30 MPa or above at 175°C after curing. The semiconductor device uses the adhesive tape to join the semiconductor component and the substrate. COPYRIGHT: (C)2008,JPO&INPIT |
