发明名称 |
Package structure to reduce warpage |
摘要 |
A package structure includes: a substrate having a chip-bearing area arranged thereon; an window type assistant element arranged on the substrate and surrounding the edge of the chip-bearing area; a plurality of chips arranged within the chip-bearing area; and a package encapsulation covering chips within the chip-bearing area. It can resist the deformation and reduce the damage from the warpage and simultaneously enhance the yield and stability of the package structure. |
申请公布号 |
US2007257345(A1) |
申请公布日期 |
2007.11.08 |
申请号 |
US20060508829 |
申请日期 |
2006.08.24 |
申请人 |
POWERTECH TECHNOLOGY INC. |
发明人 |
FAN WEN-JENG;CHEN CHENG-PIN;FANG LI-CHIH |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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