| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a laminated substrate wherein an electronic component can firmly be joined to the side surface thereof, and to provide a method of manufacturing the laminated substrate. <P>SOLUTION: The laminated substrate comprises a first insulating layer 1, a pair of conductor layers 4 deposited on one main surface and the other main surface of the first insulating layer 1 in the regions located at the end of the first insulating layer 1 in the plan view respectively, a second insulating layer 2 and a third insulating layer 3 laminated on the one main surface and the other main surface of the first insulating layer 1, respectively. The end of the first insulating layer 1 projects further than the end of the second insulating layer 2 and the end of the third insulating layer 3 in the plan view so that the conductor layers 4 are exposed outside the second insulating layer 2 and the third insulating layer 3 at the end of the first insulating layer 1, respectively. According to this structure, the electronic component 9 can be mounted on the side face of the first insulating layer 1, and the electrodes of the electronic component 9 and the conductor layers 4a and 4b formed on the first insulating layer 1 can be joined together, so that the electronic component 9 and the laminated substrate can firmly be joined together. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
