| 摘要 |
PROBLEM TO BE SOLVED: To solve problems that yield is reduced by making air residual in a coating layer as air bubbles in next layer resin coating since fine cracks are generated on an interface of a metal and a resin, in particular, in a direction vertical to the coating layer because of resin volume shrinkage that occurs after hardening a thermosetting resin in a method of forming a metal multilayer wiring body in which film thickness of one layer is 20μm or more and the thermosetting resin is used as a patterning resin. SOLUTION: By using a coating device in which viscosity of a thermosetting resin solution at a coating temperature is 100 mPa s or less, and which comprises a rotary part 21 that sucks a substrate 20 and rotates, and a discharge nozzle 22 which discharges a coating liquid and is movable; the thermosetting resin solution is linearly supplied and a coating film is formed so as not to make air residual on the interface of a metal 16 and a resin 12, 14 (in particular, in fine cracks 18 generated in the direction vertical to the coating layer 12). COPYRIGHT: (C)2008,JPO&INPIT |
