发明名称 LIQUID CARTRIDGE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To reduce manufacturing costs and improve the productivity by simplifying a molding mold and reducing the number of assembling processes in a manufacturing method of a liquid cartridge in which a substrate mounting part to mount a circuit board is prepared at an outside surface of a container body. SOLUTION: Guide wall parts 44a-44c of three sides among guide wall parts 44a-44d of four sides which constitute the substrate mounting part 41 prepared at the outside surface of the container body 31 are formed into a nearly U-shape opened to a lid body 33 side at a front outside wall 32b of a case body 32. The guide wall part 44d of the remaining one side is formed at an edge of the lid body 33. A pair of notches 46a and 46b are formed at both ends of the guide wall part 44b as a center wall part opposed to the guide wall part 44d of one side of the lid body 33 side, among the guide wall parts 44a-44c of three sides. A pair of substrate fixing bosses 42a and 42b are arranged at positions opposed to the pair of notches 46a and 46b on the front outside wall of the case body 32. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007290137(A) 申请公布日期 2007.11.08
申请号 JP20060117282 申请日期 2006.04.20
申请人 SEIKO EPSON CORP 发明人 WANIBE AKIHISA
分类号 B41J2/175;B05C5/00;B05C11/10 主分类号 B41J2/175
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