| 摘要 |
PROBLEM TO BE SOLVED: To provide a film formation method in which a plating material is prevented from being deposited at the time of electroless plating with sputtering particles stuck on a substrate and served as a core, and processes are shortened, and also to provide a manufacturing method for a liquid droplet ejection head, and the liquid droplet ejection head. SOLUTION: The film formation method comprises: a reverse sputtering process of sputtering the top face of a semiconductor substrate 100 while the semiconductor substrate 100 with through holes 101 formed therein is placed on a fixing jig for sputtering 102; a seed layer forming process of forming a seed layer 105 composed of a metal material on the top face of the reversely sputtered semiconductor substrate 100; and an electroless plating process of forming a plating layer composed of a metal material by electroless plating on the seed layer 105. The fixing jig for sputtering 102 has both a jig body 102a to place the semiconductor substrate 100 on its top face, and projections 102b formed projectingly from the top face of the jig body 102b and inserted in the through holes 101. COPYRIGHT: (C)2008,JPO&INPIT
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