| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a new method and composition for manufacturing electronic devices such as integrated circuits, in particular, to provide a coating composition for photolithography. <P>SOLUTION: In a first aspect, the method comprises: (a) applying a curable composition on a substrate; (b) applying a hard mask composition above the curable composition; (c) applying a photoresist composition layer above the hard mask composition wherein one or more of the compositions are removed in an ash-free process. In a second aspect, the method comprises: (a) applying an organic composition on a substrate; (b) applying a photoresist composition layer above the organic composition, wherein the organic composition comprises a material that produces an alkali-soluble group upon thermal and/or radiation treatment. Related compositions are also provided. <P>COPYRIGHT: (C)2008,JPO&INPIT |
