| 摘要 |
PROBLEM TO BE SOLVED: To provide an enhanced manufacturing method of a printed wiring board formed of a copper-clad laminate which can reduce short-circuiting defects caused by exposure blur when forming a thin-line pattern. SOLUTION: The manufacturing method of a printed wiring board is constituted such that a photosensitive resin dry film is laminated on the copper foil surface of the copper-clad laminate, and that an ultraviolet-ray exposure process is carried out so as to form a copper circuit while bringing a mask film into close contact by evacuation. A piece of transparent tape which forms an air byroad for evacuation is stuck beforehand to the mask film which is closely contacted with the dry film by evacuation. COPYRIGHT: (C)2008,JPO&INPIT
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