| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition, an adhesive film and a resin varnish which are excellent in the precision in the registering for the application of a resin composition when applied on a substrate and besides which is improved in the resolution in a patterning treatment in the photolithographic technique. SOLUTION: The resin composition to form an adhesive layer used for bonding a semiconductor component and a substrate comprises a resin having a radically polymerizable double bond, a thermosetting resin and a resin having an alkali-soluble group and a double bond. COPYRIGHT: (C)2008,JPO&INPIT
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