发明名称 GROOVE PROCESSING FOR SOLDER WIRE TO PREVENT FLUX DISSIPATION
摘要 PROBLEM TO BE SOLVED: To prevent dissipation of flux contained in a solder wire when performing groove-processing of the solder wire. SOLUTION: When a flux part is opened by a rotary blade for subjecting groove-processing to the solder wire containing the flux, a solder alloy constituting the outer peripheral part of the solder wire is extended along the blade shape of the rotary blade in a horn shape so as to cover the cross section of the opened flux constituting the center part, and the solder alloy part in contact with the tip part of the blade is separated from the extended part and disrupted to open the flux part, so as to perform continuous groove-processing in the groove direction of the solder wire. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007290026(A) 申请公布日期 2007.11.08
申请号 JP20060143351 申请日期 2006.04.22
申请人 KITANO SHOICHI 发明人 KITANO SHOICHI
分类号 B23K35/40;B23K3/06 主分类号 B23K35/40
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