Thermal Management Device For A Memory Module

摘要

A memory module which includes a memory board having two major surfaces, one of the major surfaces with a plurality of chips thereon, wherein at least one of the chips operates at a higher power than at least one other of the chips; and a thermal management system in thermal contact with one or more of the chips which operate at a higher power than at least one other of the chips, wherein the thermal management system spreads heat generated by the one or more of the chips which operate at a higher power than at least one other of the chips with which the thermal management system is in contact.