发明名称 Polishing Pad and Method Thereof
摘要 A polishing pad and fabricating method thereof includes a polishing pad body and at least a compressibility-aiding stripe. The compressibility-aiding stripe is buried in the polishing pad body and has a larger compressibility than that of the polishing pad body.
申请公布号 US2007259612(A1) 申请公布日期 2007.11.08
申请号 US20070688457 申请日期 2007.03.20
申请人 IV TECHNOLOGIES CO., LTD. 发明人 CHANG YUNG-CHUNG;CHANG SHEN-YU;SHIH WEN-CHANG
分类号 B24D11/00 主分类号 B24D11/00
代理机构 代理人
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