发明名称 |
Polishing Pad and Method Thereof |
摘要 |
A polishing pad and fabricating method thereof includes a polishing pad body and at least a compressibility-aiding stripe. The compressibility-aiding stripe is buried in the polishing pad body and has a larger compressibility than that of the polishing pad body.
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申请公布号 |
US2007259612(A1) |
申请公布日期 |
2007.11.08 |
申请号 |
US20070688457 |
申请日期 |
2007.03.20 |
申请人 |
IV TECHNOLOGIES CO., LTD. |
发明人 |
CHANG YUNG-CHUNG;CHANG SHEN-YU;SHIH WEN-CHANG |
分类号 |
B24D11/00 |
主分类号 |
B24D11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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