| 摘要 |
A chip type semiconductor light emitting device includes a semiconductor light emitting chip connected to a pair of electrodes formed on a substrate. The semiconductor light emitting chip is molded together with respective portions of the electrodes by a resin. The electrode has a layered structure having a Cu layer, an Ni layer and an Au layer in the order from the below. Disconnection is formed in the Au layer at a position inside the mold. <IMAGE> |
