| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor package and mounting method thereof for increasing joining strength between the semiconductor package and an external board, and not deteriorating levelness of the semiconductor package for the external substrate by increasing joining strength between the insulated wiring board and joining material, and also to provide an insulated wiring board and manufacturing method thereof used for such semiconductor package. SOLUTION: A CSP10 is provided with a surface wiring pattern 103a on the front surface side, the insulated wiring board 103 forming an externally connected electrode 103c electrically connected to the front surface wiring pattern 103a with an internal wiring 103b in the rear surface side, and a semiconductor chip 102 mounted on the front surface side of the insulated wiring board 103 and electrically connected to the front surface wiring pattern 103a. The external connecting electrode 103c is formed of a conductive film 13 formed at the bottom surface and the side surface of the concave part 12 with bottom provided on the rear surface of the insulated wiring substrate 103. COPYRIGHT: (C)2008,JPO&INPIT |
