| 摘要 |
PROBLEM TO BE SOLVED: To stably obtain a predetermined film thickness distribution when employing a multiple chanfering for producing a plurality of panels on a large-size substrate. SOLUTION: Vapor deposition on a substrate is performed by evaporating evaporation particles 7 from a vapor deposition source 3 arranged opposite to the substrate 5 in a vacuum chamber 1. By changing a distance TS between the substrate 5 and an opening 3a provided at the vapor deposition source 3 by a vapor deposition source position control mechanism 4, change with elapse of time in the film thickness distribution of a thin film deposited on the substrate is controlled. COPYRIGHT: (C)2008,JPO&INPIT
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