| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method and apparatus for correcting a sucking position of an electronic component capable of correcting a component sucking position with high accuracy by detecting a center position of a component containing hole with high reliability. <P>SOLUTION: The apparatus applies line scanning to an image of the imaged component containing hole 41 to acquire density data of one line or projection data of a plurality of lines. The apparatus executes a correlation arithmetic operation between acquired data P(x) and data Q(x) in linear symmetry with a vertical line perpendicular to the acquired data with respect to a line to obtain a vertical line providing a maximum correlation value and acquires a position on the line as a center position Cx in a line direction of the component containing hole. Since the center position of the component containing hole can be detected with high reliability, the correction accuracy of the sucking position of the electronic component can be enhanced. <P>COPYRIGHT: (C)2008,JPO&INPIT |
