| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, when connecting nearly rectangular mount electrodes formed on the bottom face of a package of a surface-mounting electronic device and lands on a circuit board by solder, large stress is applied to solder connecting portions located away from the center of the bottom face of the electronic device due to heat cycles, vibrations, shocks, etc., which easily causes cracks. SOLUTION: The surface-mounting electronic device comprises a package 2 whose bottom face has a nearly rectangular shape, and nearly rectangular mount electrodes 5 formed on the bottom face of the package along with at lest one side, respectively. At two corners at a side proximate with one side of the bottom face of the package in the corners of the mount electrodes, a linear chamfered part 5a is provided which is formed by cutting the corners in a right triangle shape. COPYRIGHT: (C)2008,JPO&INPIT
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