| 摘要 |
PROBLEM TO BE SOLVED: To obtain an inspection method of a semiconductor device employing a movable stage to which a semiconductor device can be secured, and a stage for cleaning a probe pin in which electrical inspection of a semiconductor device can be performed with high precision. SOLUTION: An upper surface 17A of a stage 17 for a semiconductor device and/or an upper surface 23A of a cleaning stage 23 are adjusted to become substantially horizontal, based on a displacement detected by a means 35 for detecting the displacement of a second position in the vertical direction of other place on the upper surface 17A of the stage 17 for semiconductor device, and/or the upper surface 23A of the cleaning stage 23 from a first position in the vertical direction of a predetermined place on the upper surface 17A of the stage 17 for semiconductor device and/or the upper surface 23A of the cleaning stage 23. COPYRIGHT: (C)2008,JPO&INPIT
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