| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of grounding ground wires at low inductance and low resistance, and having an excellent transmission characteristic of a high frequency signal in a signal line. SOLUTION: The wiring board 9 includes a pair of signal lines 2 opposed to each other in a lamination direction, and a pair of ground wires 3 between which the pair of signal lines 2 are held from both the sides in a direction orthogonal to the lamination direction in an insulating substrate 1 constituted of laminating a plurality of insulating layers 1a. In a cross-sectional view in the lamination direction, the pair of signal lines 2 are arranged in an area held between the pair of ground lines 3. COPYRIGHT: (C)2008,JPO&INPIT |
