发明名称 THERMAL ANALYSIS UNIT, THERMAL ANALYSIS METHOD, AND THERMAL ANALYSIS TRANSACTION PROGRAM
摘要 PROBLEM TO BE SOLVED: To optimize temperature distributions in a metal mold or the like by expressing a shape including a fine concavo-convex portion by a structure in large and small hexahedral meshes of minimum necessary number and thermally analyzing it. SOLUTION: A thermally analyzing method comprises a step 11 of splitting and defining an optional spatial domain which includes a space where a three-dimensional model for analysis exists as a fine hexahedral mesh spatial domain, a step 12 of determining a physical property of the fine hexahedral mesh spatial domain, a step 13 of collectively redefining a plurality of the fine hexahedral mesh spatial domain as one minute fine hexahedral mesh spatial domain when the physical properties of adjacent fine hexahedral spatial domains are the same, a step 14 of creating the hexahedral mesh of calculating the spatial domain size of the fine hexahedral mesh spatial domain redefined, respectively, a step 15 of joint processing which gives continuity to the hexahedral mesh spatial domain for calculation by mathematically averaging the state variable of unjoined mesh nodes by mathematically averaging the state variable of the unjoined mesh nodes by a nearby node for the created hexahedral mesh for calculation and averaging the state variables according to the physical properties of the elements to be joined, and a step 16 of analyzing the analytic model of the hexahedral mesh. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2007293382(A) 申请公布日期 2007.11.08
申请号 JP20060117080 申请日期 2006.04.20
申请人 SONY CORP 发明人 IWAZU SATOSHI
分类号 G06F17/50 主分类号 G06F17/50
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