| 摘要 |
PROBLEM TO BE SOLVED: To fix an LSI to a testing device easily and surely without using an expensive IC socket. SOLUTION: A frame 11 for loading a test object LSI 1 on a mother board 10 is provided, and a through hole 13 is provided on a spot where a contact point 12 for connecting to the LSI 1 inside the frame 11 is not formed. A probe 21 for connecting to a pad on the back of the mother board 10, and a space 22 and a discharge tube 23 for vacuum-adsorbing the mother board 10 are provided on a tester head 20 for loading the mother board 10 and connected the LSI 1 to a testing device body. When the mother board 10 is loaded on the tester head 20, and the test object LSI 1 is loaded on the mother board 10, and a vacuum pump connected to the discharge tube 23 is operated, the mother board 10 is adsorbed to the tester head 20, and the LSI 1 is adsorbed to the mother board 10. COPYRIGHT: (C)2008,JPO&INPIT
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