| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition affording an organic insulating layer having a low coefficient of thermal expansion and readily removing smears. SOLUTION: The resin composition comprises (1) a cyanate ester resin, (2) an anthracene type epoxy resin and (3) a thermoplastic resin. COPYRIGHT: (C)2008,JPO&INPIT |
