| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device or flip chip type semiconductor device which does not cause peeling or cracking. SOLUTION: This liquid epoxy resin composition comprises (A) an epoxy resin of formula (4) or (5), (B) an aromatic amine-based curing agent, and (C) an inorganic filler. COPYRIGHT: (C)2008,JPO&INPIT
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