| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device in which reduction in the area of a semiconductor chip is sufficiently attained. SOLUTION: A semiconductor chip 1 includes: I/O cells 11, 12, 13, 21, 22, 23 arrayed along two sides 10, 20 in contact with each other; a corner cell 31 arranged inside the array of the I/O cells 11, 12, 13, 21, 22, 23 in a corner 30 where these two sides 10, 20 are brought into contact with each other; and recognition marks 41, 42 formed at a position of the corner 30 where the two sides 10, 20 are brought into contact with each other, in parallel with the array of the I/O cells 11, 12, 13, 21, 22, 23. COPYRIGHT: (C)2008,JPO&INPIT
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