发明名称 Semiconductor device, semiconductor layer and production method thereof
摘要 A semiconductor device is prepared by the use of a vapor phase method and is provided with a semiconductor layer composed of boron phosphide (BP) having a band gap at room temperature of not less than 2.8 eV and not more than 3.4 eV or a boron phosphide (BP)-base mixed crystal which contains the boron phosphide (BP) and which is represented by the formula: B<SUB>alpha</SUB>Al<SUB>beta</SUB>Ga<SUB>gamma</SUB>In<SUB>1-alpha-beta-gamma</SUB>P<SUB>delta</SUB>As<SUB>∈</SUB>N<SUB>1-delta-∈</SUB> (0<alpha<=1, 0<=beta<1, 0<=gamma<1, 0<alpha+beta+gamma<=1, 0<delta<=1, 0<=∈<1, 0<delta+∈<=1).
申请公布号 US2007259510(A1) 申请公布日期 2007.11.08
申请号 US20070819382 申请日期 2007.06.27
申请人 SHOWA A DENKO K.K. 发明人 UDAGAWA TAKASHI
分类号 H01L21/20;C30B25/02;H01L21/18;H01L21/205;H01L21/335;H01L27/15;H01L29/20;H01L29/201;H01L29/205;H01L29/778;H01L31/0304;H01L31/18;H01L33/12;H01L33/30 主分类号 H01L21/20
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