| 摘要 |
A method for applying a solder to a substrate by positioning solder in a solid state, melting it and then impacting it against a substrate by means of compressed gas. The method utilizes a holder having a capillary bore whose diameter, at the substrate end, has a contraction whose diameter (D 2 ) is smaller than the diameter (D 3 ) of the solder globule, an energy source connected to the capillary, and a compressed gas source connected to the capillary.
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