| 摘要 |
A semiconductor package is provided to restrain the generation of cracks or delamination by determining the amount of moisture directly applied to the semiconductor package using a moisture display portion. A semiconductor package includes a body portion, a semiconductor chip, a lead frame and a moisture display portion. The body portion(31) is made of a molding compound. The semiconductor chip(43) is installed in the body portion. The lead frame(33) is installed in the body portion. The lead frame is composed of an inner lead and an outer lead. The inner lead connects the semiconductor chip with a circuit board. The outer lead is connected with the inner lead. The moisture display portion(47) is installed at one surface of the body portion in order to measure the amount of moisture applied to the inside of the body portion from the outside. |
