MULTILAYER PRINTED WIRING BOARD

摘要

An object of the present invention is to provide a multilayer printed circuit board where there is greater freedom in design, miniaturization can be achieved, and furthermore, a circuit with high density can be easily handled. A multilayer printed circuit board according to the present invention is a multilayer printed circuit board where a plurality of insulating layers, a conductor circuit and an optical circuit are formed and layered and an optical element is mounted, wherein the above described optical circuit is formed between the above described insulating layers.