Sheet to form a protective film for chips and process for producing semiconductor chips

摘要

The present invention provides a sheet (10) to form a protective film for chips, which can be readily formed into a highly uniform protective film on a back surface of chip, and which, even if minute scratches are formed on the back surface of chip as a result of mechanical grinding, can eliminate adverse effects resulting from the scratches. The sheet (10) to form a protective film for chips of the present invention comprises a release sheet (1) and a protective film forming layer (2) formed on a detachable surface of the release sheet, wherein said protective film forming layer comprises a thermosetting or energy ray-curable component and a binder polymer component.