THERMAL MANAGEMENT DEVICE FOR A MEMORY MODULE

摘要

A thermal management device of a memory module is provided to be used for a memory module, in which at least one memory module operates at a higher temperature than those at of others. A memory module includes a memory board(110) and a thermal management system(10). The memory board has two major surfaces. One of the two major surfaces has a plurality of chips thereon. At least one of the chips operates a higher power than that of at least one other chip. The thermal management system thermally contacts with at least one of the chips, which operates at a higher power than at least on other chip. The thermal management system spreads heat generated by the at least chip that operates at a higher power than that of the other chips. The thermal management system has a heat spreader. The heat spreader includes at least one sheet of compressed particles of peeled graphite having a thermal passage.