| 摘要 |
<p>The following alloys (compositions by weight) are used in the manufacture of semi-conductor devices (see Division H1): 3-20% copper or silver, balance tungsten; 89% aluminium, 11% silicon; 1% antimony, 2% lead, balance silver; 1% antimony, balance gold; 1% antimony, 27% copper, balance silver; 10% tin, balance silver; 2% lead, 2% silicon, balance silver; 5% germanium, balance silver; 0.5% phosphorus, 27.5% copper, balance silver; 2% silicon, 98% gold; 2% tin, 98% gold; 1% boron, balance gold; 2% antimony, balance gold. Specification 881,090 is referred to.</p> |
