发明名称 COMPUTER COOLING STRUCTURE
摘要 A cooling structure of a computer is provided successfully to cool other chips set as well as a CPU(Central Processing Unit) inside the computer by allowing air inside the computer to flow in one direction smoothly. A cooling structure of a computer includes a case(100), a main board(110), a CPU(120), a CPU cooler(200), and a fan(130). Each part of the computer is coupled to the case. The main board is mounted to the case. The CPU is mounted on the main board. The fan is formed at one side of the case. The CPU cooler discharges the heat generated in the CPU, and includes a plate(210), a plurality of heat pipes(230), and a plurality of heat sinks(250). The heat sink is connected to the upper plane of the CPU, and receives the heat from the CPU. The plurality of heat pipes are connected to the plate, and receive the heat from the plate. The plurality of plates are connected to the heat pipes, and receive the heat from the heat pipes.
申请公布号 KR20070107214(A) 申请公布日期 2007.11.07
申请号 KR20060039419 申请日期 2006.05.02
申请人 LG ELECTRONICS INC. 发明人 KIM, KYOUNG HO
分类号 G06F1/20 主分类号 G06F1/20
代理机构 代理人
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