发明名称 |
Circuit board having electronic parts mounted thereon by using under-fill material and method for producing the same |
摘要 |
Aboard 1 according to the present invention includes a board main body 3; electronic parts 5 electrically connected to and mounted on the board main body 3; and an under-fill material 19 with which a part between the board main body 3 and a surface of the electronic parts 5 electrically connected to the board main body is filled. A hole 21 passing through a layer 19a of the under-fill material that flows outside from a connecting area of the electronic parts 5 and the board main body 3 is provided for electrically connecting other parts to the board main body. |
申请公布号 |
EP1761116(A3) |
申请公布日期 |
2007.11.07 |
申请号 |
EP20060017440 |
申请日期 |
2006.08.22 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
MACHIDA, YOSHIHIRO |
分类号 |
H01L21/56;H01L23/31;H05K1/18;H05K3/30 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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