发明名称 |
Semiconductor light emitting device and semiconductor light emitting unit |
摘要 |
A semiconductor light emitting device comprises: embedding resin; a first lead having a first inner lead section embedded in the embedding resin and a first outer lead section protruding from one side face of the embedding resin; a second lead having a second inner lead section embedded in the embedding resin and a second outer lead section protruding from a side face opposed to the one side face of the embedding resin; a semiconductor light emitting chip mounted on a portion of the first inner lead section exposed in a recess provided on an upper face of the embedding resin; and a wire connecting the semiconductor light emitting chip with the second lead. The first and second inner lead sections and the first and second outer lead sections each have a substantially coplanar rear face. At least a part of the rear face of the first inner lead section and at least a part of the rear face of the second inner lead section are not covered with the embedding resin but are exposed.
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申请公布号 |
US7291866(B2) |
申请公布日期 |
2007.11.06 |
申请号 |
US20050149461 |
申请日期 |
2005.06.10 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
OSHIO HIROAKI;MATSUMOTO IWAO;MIYAKAWA TAKESHI;TAKEZAWA HATSUO |
分类号 |
H01L29/22;H01L33/56;H01L33/60;H01L33/62;H01L33/64 |
主分类号 |
H01L29/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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