发明名称 |
IC socket and IC socket assembly |
摘要 |
An integrated circuit socket comprises an insulative housing having an integrated circuit package receiving recess provided with a plurality of contact receiving openings arranged in a matrix. Contacts are arranged in the contact receiving openings. Each of the contacts has a base fixed to the contact receiving opening and a contact arm that extends away from the base. The contact arm has a contact portion with a contact point at an uppermost end. The contact portion overlaps with the contact arm of an adjacent one of the contacts. First partition walls separate the contact receiving openings in a direction substantially perpendicular to a direction in which the contact arms extend. The uppermost ends are arranged below tops of the first partition walls.
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申请公布号 |
US7291021(B2) |
申请公布日期 |
2007.11.06 |
申请号 |
US20050202277 |
申请日期 |
2005.08.11 |
申请人 |
TYCO ELECTRONICS AMP K.K. |
发明人 |
SHIRAI HIROSHI;HASHIMOTO SHINICHI |
分类号 |
H05K1/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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