SUBSTRATE TREATMENT METHOD AND FILM FORMING METHOD, FILM FORMING APPARATUS, AND COMPUTER PROGRAM

摘要

There is provided a substrate treatment method performed on a substrate before forming a Cu film on a surface of undercoat material of the substrate. The substrate treatment method includes: a preparation step for preparing a substrate on which a Cu film is to be formed; and a treatment step for performing a predetermined treatment on the substrate so that the crystal on the surface of the undercoat of the substrate exhibits such an orientation that the grating mismatch between the crystal and the Cu film is small.