发明名称 |
Circuit board and method of manufacturing the same |
摘要 |
A circuit board includes an insulating substrate, a first conductive layer on the insulating substrate, a second conductive layer on the first conductive layer, and a third conductive layer covering the first conductive layer and the second conductive layer. The first conductive layer has a surface provided on the surface of the insulating substrate, and a surface having a width smaller than a width of the above surface. In this circuit board, the conductive layers have small impedances even if a high-frequency signal flows in the conductive layers.
|
申请公布号 |
US7291915(B2) |
申请公布日期 |
2007.11.06 |
申请号 |
US20050203124 |
申请日期 |
2005.08.15 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
SUGAWA TOSHIO;HIGASHITANI HIDEKI;MISAKI TAKUMI |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|