| 摘要 |
An exposure apparatus is provided to obtain a linear relationship for approximating the deviation in the position of a measured alignment mark while avoiding a need for increasing the number of alignment marks measured for each wafer, thereby increasing the throughput of a semiconductor device. An exposure apparatus comprises: a wafer stage(104) for maintaining and moving a wafer(103); a measuring unit(106) for measuring the deviation in the position of a mark on the wafer maintained by the wafer stage; a calculation unit(107) for calculating a linear relationship by which the deviation in the position is approximated; and a control unit(108) for controlling the position of the wafer stage according to a desired position based on the linear relationship to carry out exposure of the exposure region on the wafer. The calculation unit is designed to allow the linear relationship to be obtained according to the integer programming method so as to minimize the number of marks beyond the predetermined range of the difference between the deviation in the position of a mark measured by the measuring unit and the deviation in the position of a mark approximated according to the linear relationship. |
