SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

摘要

A semiconductor device and a fabricating method thereof are provided to prevent a bonding region from being damaged due to a probe tip by physically separating the probing region and the bonding region using a protruding pattern. A wiring layer(102) is formed on a substrate(100), and has a first pad contact region(102a) and a second pad contact region(102b). A passivation layer(103) has a first opening(105a) exposing the first pad contact region, a second opening(105b) exposing the second pad contact region, and a protruding patterns(104) separating the first and second openings. A pad metal pattern is conformally formed along the first and second openings and the protruding pattern.